Peltier Module

A thermoelectric cooling (TEC) or Peltier Module is a semiconductor-based electronic component that functions as a small heat pump. By applying DC power source to a Peltier Module, heat will be transferred from one side of the module to the other. It creates a cold and hot side. They are widely used in industrial areas, for example, computer CPU, CCDs, portable refrigerators, medical instruments, and so on.
Please radiating the heating side, avoid using under no-radiating condition over 2s\Coated with thermal grease when install the device.

Peltier Module will typically produce a maximum temperature difference of 30-40 C between its hot and cold sides. The more heat moved using a thermoelectric cooling, the less efficient it becomes, because the Peltier Module needs to dissipate both the heat being moved, as well as the heat it generates itself from its own power consumption therefore the amount of heat that can be absorbed is proportional to the current and time.
W = Plt
where P is the Peltier Coefficient, I is the current, and t is the time. The Peltier Coefficient is dependent on temperature and the materials the TEC is made of.
Notes:
Power ON the device only with proper Heat-sink setup to avoid any burning/damage or malfunction of the device!
Use a good quality heat-sink (such as in CPU fans) with thermal paste and power the device.
Use a 12 VDC SMPS Power supply to power the Peltier Module
Use ONE AA battery for 10-20 seconds to power ON the device to find the hot /cold side.
Warning!
Power ON the device only with proper Heat-sink setup to avoid burning/damage/malfunction of device!
The hot surface Th of the thermoelectric cooling must be attached to a suitable FAN & HEAT-SINK (105 x 105 x 40mm) that is capable of carrying away both the heat pumped by the thermoelectric cooling plus Joule heat from the electric power supplied to the thermoelectric cooling. A heat-sink rise of 15C above ambient is typical for many thermoelectric cooling applications. Otherwise, a bigger heat-sink must be used to reduce temperature.
Care should be taken when applying pressure during installation to avoid ceramic damage. Uniform pressure is desired across the mounting surfaces. If uneven pressure is applied, thermal performance may be reduced or damage may occur to the thermoelectric cooling.